CSR

CORPORATE SOCIAL RESPONSIBILITYRegulation Compliance

RoHS & REACH

RoHS

RoHS (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment)
The purpose of this Directive is to appoximate the laws of the Member States on the restrictions of the use of hazardous substances in electrical and electronic equipment and to contribute to the protection of human health and the environmentally sound recovery and disposal of waste electrical and electronic equipment.
Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, haxavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).
6 Critical Hazardous Substance
Pb, Cd, Cr+6, Hg PBB (Polybrominated biphenyl), PBDE (Polybrominated diphenylethers)
Thresholds For RoHS Substances
Substance MCV (Maximum Concentration Value)
Cd < 100 ppm
Pb < 1000 ppm
Hg < 1000 ppm
Cr+6 < 1000 ppm
PBB < 1000 ppm
PBDE < 1000 ppm

Complying with RoHS 2

RoHS 2, announced in 2011, includes using the CE Mark (2013), which guarantees that the product is not using prohibited materials, discarding the exceptional clauses (2016), and adding prohibited materials (2015). SK hynix obtained the CE Mark for our module products and recognized the additional prohibited materials in order to prepare for the guarantee system as RoHS 2 takes effect in 2019.
Additional prohibited materials are indicated below.

Substance CAS No Limit
DEHP (Bis(2-ethylhexyl) phthalate) 117-81-7 1000 ppm
BBP (Butylbenzyl phthalate) 85-68-7 1000 ppm
DBP (Dibuthyl phthalate) 84-74-2 1000 ppm
DIBP (Di isobutyl phthalate) 84-69-5 1000 ppm

What is REACH

REACH abbreviate the words of Registration, Evaluation, Authorization of Chemical. REACH is a regulation to control and restrict chemical or product import by Registration, Evaluation, Authorization along the import quantity and degree of environmental risk. So material and product manufacturer needs to contol product composition and substance’s environmental risk management.

SK hynix Compliance Situation to REACH

SK hynix certify that SK hynix guarantee and comply to REACH regulation by below fact. SK hynix don’t have duty of registration by the reason that SK hynix’ products are classified as non-exposure article. SK hynix don’t have duty of notification by the reason that SK hynix’ product free from currently presented SVHC’s 46 substance. As guarantee SK hynix can share composing substance of product with customer by right appropriate process. SK hynix have been remaining relationship of communication about environmental information to confirm SVHC substance.

China RoHS

Overview

  • Management Methods for Controlling Pollution by Electronic Information Products : Administrative guide and Management Methods on the Control of Pollution Caused by Electronic Information Products
  • Enforcement period : March 1, 2007
  • Requirement : Electronic Information Products Pollution Control Logos , Marking for Toxic or Hazardous Material or Elements, Recycle Mark of packing material
  • hazardous substances : 6 Hazardous Substance. Pb (Lead), Hg (Mercury), Cd (Cadmium), Cr+6 (Hexavalent chromium), PBB , PBDE
Substance MCV (Maximum Concentration Value)
Cd < 100 ppm
Pb < 1000 ppm
Hg < 1000 ppm
Cr+6 < 1000 ppm
PBB < 1000 ppm
PBDE < 1000 ppm

Electronic Information Products Pollution Control Logos

  • e Mark  When hazardous substances are not used : hazardous substance safety mark is marked.
  • Environmental Protection Use Period Mark  When hazardous substances are used : "Environmental Protection Use Period" is marked.

Marking for Toxic or Hazardous Material or Elements

  • If a certain hazardous substance is not contained in the component or hazardous substance contained in the component is below the limit requirement in SJ/T11363-2006 : 'O' is marked.
  • If hazardous substance contained in the component is above the limit requirement in SJ/T11363-2006 : 'X' is marked.

Recycle Mark of packing material

  • This mark is attached to inner and outer packing Box.
  • “CB” mean that the used packing material of products is Corrugated Cardboard.
  • Standard : GB18455-2001 of China (Packaging Recycling Marks standard)

Component Product

  • Electronic Information Products Pollution Control Logos :
  • Marking for Toxic or Hazardous Material or Elements
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
Si CHIP
GOLD WIRE
MOLD COMPOUND
LEAD FRAME
SUBSTRATE
SOLDER BALL
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type

Module Product

  • Electronic Information Products Pollution Control Logos :
  • Marking for Toxic or Hazardous Material or Elements
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
Component
PCB
ACTIVEIC
CAPACITOR
RESISTOR
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • Resister in module contains lead partially in order to electronic quality. It is impossible to unuse by present technological level

CIS Product

  • Electronic Information Products Pollution Control Logos :
  • Marking for Toxic or Hazardous Material or Elements
Component Name Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chrome
(Cr6+)
Polybrominated
Biphenyl
(PBB)
Polybrominated
Biphenyl Ether
(PBDE)
Si CHIP
GLASS
SOLDER BALL
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type

SSD Product

  • Electronic Information Products Pollution Control Logos :
  • Marking for Toxic or Hazardous Material or Elements
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
PCB
Solder Paste
Active device
Passive device
Case
Accessory
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • Passive device Resistor in SSD contains Pb (lead) partially for electronic quality. It is impossible for disuse at present due to technological matter.

Halogen Free

Hazardous halogen & the necessity for substitution

What are the elements belong to the halogen family?
They are fluorine, chloride, bromine and iodine, all of which are very active and used as a fire retardant for the semiconductor package material.
Harmfulness & the necessity for substitution
Toxic substances such as dioxin and difuran are generated if incinerated.
These substances tend to accumulate in a human body for a long period of time causing environmental hormone problems In particular fluorine, chloride and bromine are known to severe depletion of ozone layer when exposed to the atmosphere, and for this reason regulation is being increasing reinforced with EU leading such regulation trends.
EU and Japan are expected to take the lead in implementing the regulation beginning from 2008, and for this reason the halogen substance used for manufacturing the semiconductor must find a substitute.

Halogen-free Regulation Standards

  • JPCA(Japan Electronics Packaging and Circuits Association) JPCA-ES-01-1999 defines Circuits and method for "halogen-free“

    Br < 0.09wt%(900ppm), CI < 0.09wt%(900ppm)

  • IEC(International Electrotechnical Commission) Finalized requirements of IEC 61249-2-21

    • 900ppm maximum CI, 900ppm maximum Br
    • 1500 ppm maximum total halogens
  • IPC - 4101B has adopted the IEC definition of halogen-free

    • 900ppm maximum CI, 900ppm maximum Br
    • 1500 ppm maximum total halogens
  • Note

    fluorine, iodine, and astatine (other Group VIIA halogens) are not restricted in the industry definition of "halogen-free“.

Mass Production Status

Mass Production Status
PRODUCT 07 08 09 10
DRM
NAND Flash
CIS

Identify the halogen-free products

Halogen Free 제품 구분
FROM TO
HXXXXXXXXXP-XXX HXXXXXXXXXR-XXX
P:RoHS Compliance R:RoHS Compliance + Halogen Free

Letter of Guarantee

PRODUCT Package RoHS REACH PFOS HALOGEN FREE
DRAM Component Satisfy Certificate [152KB] Satisfy Certificate [548KB] Satisfy Certificate [96KB] Partly Satisfy Certificate [96KB]
Module
NAND Flash Component
MCP Component
CIS Component
SSD Module

※ Halogen Free product information will vary depending on the warranty that can be regulated by our warranty will be distributed.