128GB 3DS LRDIMM is a high-density module product built with SK hynix’s TSV technology. TSV (Through Silicon Via) is a technology of making via holes on a wafer and 3D-stacking through chip-to-chip/wafer-to-wafer bonding.
The term 3DS refers to the single package 3D solution comprised of four stacked DRAM dies and a logic controller.
TSV technology will enable memory manufacturers to build higher-speed, higher-density, and smaller-sized module products.
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