CORPORATE SOCIAL RESPONSIBILITYRegulation Compliance
RoHS & REACH
RoHS
- 符合RoHS（在電氣和電子設備使用某些有害物質的限制
- 此法目的是用法律在電氣和電子設備使用的有害物質制定限制，保護人類健康和WEEE的可持續復甦。 2006年7月起新的電氣和電子必須不含有鉛，汞，鎘，鉻6，多溴聯苯核苷酸咀（PBB）或多溴聯苯醚核苷酸咀（PBDE）。
- 6 CRITICAL HAZARDOUS SUBSTANCE
- Pb, Cd, Cr+6, Hg, PBB (Polybrominated biphenyl), PBDE (Polybrominated diphenylethers)
- THRESHOLDS FOR ROHS SUBSTANCES
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Thresholds for RoHS substances Substance MCV (Maximum Concentration Value) Cd < 100 ppm Pb < 1000 ppm Hg < 1000 ppm Cr+6 < 1000 ppm PBB < 1000 ppm PBDE < 1000 ppm
RoHS 2 響應及準備
內容有2011年發佈的RoHS2使用保證未使用禁止物質的CE Mark（2013年），執行廢除例外條款（2016年），添加禁止物質（2015年）。SK海力士執行Module 產品的 CE Mark，獲取禁止物質添加物質，本公司並且準備保證系統對應2019年的發酵時期。
| Substance | CAS No | Limit |
|---|---|---|
| DEHP (Bis(2-ethylhexyl) phthalate) | 117-81-7 | 1000 ppm |
| BBP (Butylbenzyl phthalate) | 85-68-7 | 1000 ppm |
| DBP (Dibuthyl phthalate) | 84-74-2 | 1000 ppm |
| DIBP (Di isobutyl phthalate) | 84-69-5 | 1000 ppm |
What is REACH
REACH是註冊，評估，化學品的授權的術語是根據每年一噸以上生產和輸入的物品，進行數量和危險度的註冊，評估，許可，限制， 而進行新化學物質的管理規定。
不僅僅是禁止使用六大有害物質，而且掌握並管理全部化學物質。
SK hynix Compliance Situation to REACH
SK hynix 根據以下事實，保證滿足 EU REACH 規定。SK hynix產品已確認到雖然以 Article分類，但不排除含有物質即無登記對象及義務，並且確認到當前登記的SVHC 不包含高危險後補物質即高危險物質，無申報對象及義務。
以此作為保證，對客戶的信息要求，依據保密保證書等徹底的程序，共享產品物質組成信息。SK hynix為了保證對日後可能添加的新SVHC物質，與原材料企業保持著溝通體系及信息共享等合作關係。
當前2015年SVHC高危險後補物質有163種，高危險物質有31種登記在案。
China RoHS
概要
- 電子信息產品污染防治法：中國政府要求的所有的電子信息產品，環境污染法規，行政準則管理指
- 有效日期 : 03/01/2007
- 要求：危險物質，有害物質的信息公開，標誌包裝回收標誌
- 受控物質：六種物質。 Pb（鉛），汞（水銀），鎘（鎘），六價鉻（6鉻），多溴聯苯，多溴二苯醚
| Substance | MCV (Maximum Concentration Value) |
|---|---|
| Cd | < 100 ppm |
| Pb | < 1000 ppm |
| Hg | < 1000 ppm |
| Cr+6 | < 1000 ppm |
| PBB | < 1000 ppm |
| PBDE | < 1000 ppm |
要求事項 有害物質標誌
如果符合滿足有害物質容許濃度：“e“ 的標誌
如果超過的有害物質容許濃度：標記環“境保護使用期限“
要求 - 有害物質的信息公開
- 有害物質或產品含有濃度如果超過SJ/T11363-2006規定：“X“ 號顯示
- 產品未含有有害物質或低於SJ/T11363-2006 規定：“O“ 號顯示
要求—包裝回收標誌
- This mark is attached to inner and outer packing Box.
- “CB” mean that the used packing material of products is Corrugated Cardboard.
- Standard : GB18455-2001 of China (Packaging Recycling Marks standard)
Component Product
- 有害物質符號 :
- 公開有害物質情報
| Part Name | Toxic or hazardous Substances and Elements | |||||
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| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
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- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006- LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type
Module Product
- 有害物質符號 :
- 公開有害物質情報
| Part Name | Toxic or hazardous Substances and Elements | |||||
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| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
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- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- Resister in module contains lead partially in order to electronic quality. It is impossible to unuse by present technological level
CIS Product
- 有害物質符號 :
- 公開有害物質情報
| Component Name | Hazardous Substances or Elements | |||||
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| Lead (Pb) |
Mercury (Hg) |
Cadmium (Cd) |
Hexavalent Chrome (Cr6+) |
Polybrominated Biphenyl (PBB) |
Polybrominated Biphenyl Ether (PBDE) |
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| Si CHIP | |
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| GLASS | |
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- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type
SSD Product
- 有害物質符號 :
- 公開有害物質情報
| Part Name | Toxic or hazardous Substances and Elements | |||||
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| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
| PCB | |
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- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- Passive device Resistor in SSD contains Pb (lead) partially for electronic quality. It is impossible for disuse at present due to technological matter.
Halogen Free
Halogen有害性以及代替必要性
- 鹵族是指什麽?
- 鹵族包括氟(F)、氯(Cl)、溴(Br)、碘(I)等，活性較強，以Package材料的阻燃劑用于半導體行業。
- 有害性以及代替必要性
- 在燃燒過程中産生二氧化笨等有毒物質，並在人的體內長期積累，引發環境荷爾蒙問題。
特別是F、Cl、Br被認爲向大氣漏出會嚴重破壞臭氧層，EU等國際機構逐年加大限制力度。
從2008年起預計以EU、Japan爲中心直接限制鹵族，需要開發取代鹵族用于半導體制造的物質。
Halogen Free 限制規格
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JPCA(Japan Electronics Packaging and Circuits Association) JPCA-ES-01-1999 defines Circuits and method for "halogen-free“
Br < 0.09wt%(900ppm), CI < 0.09wt%(900ppm)
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IEC(International Electrotechnical Commission) Finalized requirements of IEC 61249-2-21
- 900ppm maximum CI, 900ppm maximum Br
- 1500 ppm maximum total halogens
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IPC - 4101B has adopted the IEC definition of halogen-free
- 900ppm maximum CI, 900ppm maximum Br
- 1500 ppm maximum total halogens
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Note
fluorine, iodine, and astatine (other Group VIIA halogens) are not restricted in the industry definition of "halogen-free“.
Mass Production Status
| PRODUCT | 07 | 08 | 09 | 10 |
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| DRM |  |
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| NAND Flash |  |
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| CIS |  |
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Halogen Free 産品區分
| FROM | TO |
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| HXXXXXXXXXP-XXX | HXXXXXXXXXR-XXX |
| P:RoHS Compliance | R:RoHS Compliance + Halogen Free |
響應保證書
| PRODUCT | Package | RoHS | REACH | PFOS | HALOGEN FREE |
|---|---|---|---|---|---|
| DRAM | Component | Satisfy Certificate [152KB] | Satisfy Certificate [548KB] | Satisfy Certificate [96KB] | Partly Satisfy Certificate [96KB] |
| Module | |||||
| NAND Flash | Component | ||||
| MCP | Component | ||||
| CIS | Component | ||||
| SiP | Component | ||||
| SSD | Component |
※ 因不含鹵素產品，信息的規定可能會有所不同， 固貴公司可提供保證證書。