CSR

CORPORATE SOCIAL RESPONSIBILITYRegulation Compliance

RoHS & REACH

RoHS

符合RoHS(在電氣和電子設備使用某些有害物質的限制
此法目的是用法律在電氣和電子設備使用的有害物質制定限制,保護人類健康和WEEE的可持續復甦。 2006年7月起新的電氣和電子必須不含有鉛,汞,鎘,鉻6,多溴聯苯核苷酸咀(PBB)或多溴聯苯醚核苷酸咀(PBDE)。
6 CRITICAL HAZARDOUS SUBSTANCE
Pb, Cd, Cr+6, Hg, PBB (Polybrominated biphenyl), PBDE (Polybrominated diphenylethers)
THRESHOLDS FOR ROHS SUBSTANCES
Thresholds for RoHS substances
Substance MCV (Maximum Concentration Value)
Cd < 100 ppm
Pb < 1000 ppm
Hg < 1000 ppm
Cr+6 < 1000 ppm
PBB < 1000 ppm
PBDE < 1000 ppm

RoHS 2 響應及準備

內容有2011年發佈的RoHS2使用保證未使用禁止物質的CE Mark(2013年),執行廢除例外條款(2016年),添加禁止物質(2015年)。SK海力士執行Module 產品的 CE Mark,獲取禁止物質添加物質,本公司並且準備保證系統對應2019年的發酵時期。

RoHS 2 響應及準備
Substance CAS No Limit
DEHP (Bis(2-ethylhexyl) phthalate) 117-81-7 1000 ppm
BBP (Butylbenzyl phthalate) 85-68-7 1000 ppm
DBP (Dibuthyl phthalate) 84-74-2 1000 ppm
DIBP (Di isobutyl phthalate) 84-69-5 1000 ppm

What is REACH

REACH是註冊,評估,化學品的授權的術語是根據每年一噸以上生產和輸入的物品,進行數量和危險度的註冊,評估,許可,限制, 而進行新化學物質的管理規定。
不僅僅是禁止使用六大有害物質,而且掌握並管理全部化學物質。

what is reach

SK hynix Compliance Situation to REACH

SK hynix 根據以下事實,保證滿足 EU REACH 規定。SK hynix產品已確認到雖然以 Article分類,但不排除含有物質即無登記對象及義務,並且確認到當前登記的SVHC 不包含高危險後補物質即高危險物質,無申報對象及義務。

以此作為保證,對客戶的信息要求,依據保密保證書等徹底的程序,共享產品物質組成信息。SK hynix為了保證對日後可能添加的新SVHC物質,與原材料企業保持著溝通體系及信息共享等合作關係。

當前2015年SVHC高危險後補物質有163種,高危險物質有31種登記在案。

China RoHS

概要

  • 電子信息產品污染防治法:中國政府要求的所有的電子信息產品,環境污染法規,行政準則管理指
  • 有效日期 : 03/01/2007
  • 要求:危險物質,有害物質的信息公開,標誌包裝回收標誌
  • 受控物質:六種物質。 Pb(鉛),汞(水銀),鎘(鎘),六價鉻(6鉻),多溴聯苯,多溴二苯醚
Substance MCV (Maximum Concentration Value)
Cd < 100 ppm
Pb < 1000 ppm
Hg < 1000 ppm
Cr+6 < 1000 ppm
PBB < 1000 ppm
PBDE < 1000 ppm

要求事項 有害物質標誌

  •   如果符合滿足有害物質容許濃度:“e“ 的標誌
  •   如果超過的有害物質容許濃度:標記環“境保護使用期限“

要求 - 有害物質的信息公開

  • 有害物質或產品含有濃度如果超過SJ/T11363-2006規定:“X“ 號顯示
  • 產品未含有有害物質或低於SJ/T11363-2006 規定:“O“ 號顯示

要求—包裝回收標誌

CB
  • This mark is attached to inner and outer packing Box.
  • “CB” mean that the used packing material of products is Corrugated Cardboard.
  • Standard : GB18455-2001 of China (Packaging Recycling Marks standard)

Component Product

  • 有害物質符號 :
  • 公開有害物質情報
公開有害物質情報
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
Si CHIP
GOLD WIRE
MOLD COMPOUND
LEAD FRAME
SUBSTRATE
SOLDER BALL
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type

Module Product

  • 有害物質符號 :
  • 公開有害物質情報
公開有害物質情報
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
Component
PCB
ACTIVEIC
CAPACITOR
RESISTOR
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • Resister in module contains lead partially in order to electronic quality. It is impossible to unuse by present technological level

CIS Product

  • 有害物質符號 :
  • 公開有害物質情報
公開有害物質情報
Component Name Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chrome
(Cr6+)
Polybrominated
Biphenyl
(PBB)
Polybrominated
Biphenyl Ether
(PBDE)
Si CHIP
GLASS
SOLDER BALL
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type

SSD Product

  • 有害物質符號 :
  • 公開有害物質情報
公開有害物質情報
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
PCB
Solder Paste
Active device
Passive device
Case
Accessory
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • Passive device Resistor in SSD contains Pb (lead) partially for electronic quality. It is impossible for disuse at present due to technological matter.

Halogen Free

Halogen有害性以及代替必要性

鹵族是指什麽?
鹵族包括氟(F)、氯(Cl)、溴(Br)、碘(I)等,活性較強,以Package材料的阻燃劑用于半導體行業。
有害性以及代替必要性
在燃燒過程中産生二氧化笨等有毒物質,並在人的體內長期積累,引發環境荷爾蒙問題。
特別是F、Cl、Br被認爲向大氣漏出會嚴重破壞臭氧層,EU等國際機構逐年加大限制力度。
從2008年起預計以EU、Japan爲中心直接限制鹵族,需要開發取代鹵族用于半導體制造的物質。

Halogen Free 限制規格

  • JPCA(Japan Electronics Packaging and Circuits Association) JPCA-ES-01-1999 defines Circuits and method for "halogen-free“

    Br < 0.09wt%(900ppm), CI < 0.09wt%(900ppm)

  • IEC(International Electrotechnical Commission) Finalized requirements of IEC 61249-2-21

    • 900ppm maximum CI, 900ppm maximum Br
    • 1500 ppm maximum total halogens
  • IPC - 4101B has adopted the IEC definition of halogen-free

    • 900ppm maximum CI, 900ppm maximum Br
    • 1500 ppm maximum total halogens
  • Note

    fluorine, iodine, and astatine (other Group VIIA halogens) are not restricted in the industry definition of "halogen-free“.

Mass Production Status

Mass Production Status
PRODUCT 07 08 09 10
DRM Compliance
NAND Flash Compliance
CIS Compliance

Halogen Free 産品區分

Halogen Free 産品區分
FROM TO
HXXXXXXXXXP-XXX HXXXXXXXXXR-XXX
P:RoHS Compliance R:RoHS Compliance + Halogen Free

響應保證書

響應保證書
PRODUCT Package RoHS REACH PFOS HALOGEN FREE
DRAM Component Satisfy Certificate [152KB] Satisfy Certificate [548KB] Satisfy Certificate [96KB] Partly Satisfy Certificate [96KB]
Module
NAND Flash Component
MCP Component
CIS Component
SiP Component
SSD Component

※ 因不含鹵素產品,信息的規定可能會有所不同, 固貴公司可提供保證證書。