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Support

SUPPORTTechnical Support

Flash Software

HiFFS is a Flash file system solution for mobile system. HiFFS is the essential system software for electronic devices which has Flash memory storage such as mobile phones, PDAs, MP3 players, PMPs, digital TVs, and digital camcorders.

Features

  • Flash memory file system solution for mobile embedded system
  • Higher performance and reliability
  • Fully compatible with FAT 12/16/32 file system standards
  • Journaling error recovery mechanism
  • Support various Nand Flash memory types such as small block, large block, MLC and SLC and TLC.
  • Efficient bad block management and wear-leveling
  • Support UMS(USB Mass Storage) and external Flash memory cards
  • Higher read/write performance
  • Fast booting
  • Support various operating systems such as WinCE, Linux, Non-OS, Windows Mobile
Flash Software Features. 다음 내용 참고
APPLICATIONS ↔ OS (Windows Movile, Linux, Win CE) ↔ Hiffs Flash File System ↔ Flash Memory

HiFFS Architecture

  • HiFFS, consists of sub modules including HFAT, HFTL, and LLD.

Flash Software HiFFS Architecture. 다음 내용 참조 Applications ↔ Operating Systems ↔ HIFFS [ HFAT ↔ HFTL(Address Translation, Bad Block Management, Block Device Interface, Wear-Leveling, Garbage collection) ↔ Low Level Driver, SW ECC (Optional) ] ↔ NAND Flash Device

HFTL(Address Translation, Bad Block Management, Block Device Interface, Wear-Leveling, Garbage collection) -> USB Driver

HFAT -> MMC/SD Card Driver -> MMC/SD Card

HFAT File System

  1. 1. Fully compatible with FAT standards (FAT12/16/32)

  2. 2. Journaling error recovery mechanism

    • Prevent damage to the file system in emergency situations such as power failure
    • Mechanism overview
      • - Create a specifically named 'log file' in root directory
      • - Leave a log when file system meta data is modified
      • - Restore the file system base on the last log when a problem arises
  3. 3. Performance maximization

    • Most suitable use of FAT cache, DIR cache, and buffer cache
    • Effective cluster allocation considering Flash memory block size
  4. 4. Support multi-volume (external Flash memory card support)

HFTL

  • Support various Flash memory types regardless of block size or page size
  • Minimize the overheads of map management by Hybrid mapping(block-level mapping + page-level mapping)
  • Higher performance
  • Atomic write for high reliability
  • Fast booting
  • Wear-leveling
  • Multi volume support
  • Common Flash device driver module
  • Coherent Flash device driver interface definition(with ease to add new LLD)
  • Low-level Flash memory management(bad block management, low-level Flash memory partitioning)
  • High-level reusability with platform independent configuration

LLD

  • Physical device driver for each Flash memory
  • Optional Software ECC

Product Document

Label Info. DDR4

DDR4 32GB 4Rx4 PC3L - 10600R-9-12 AB1 HMT84GT7AMR4A-H9 D8 AB, R1216297P

Label Information

Label Information DDR4 Label Information DDR4의 Definition, Description을 나타낸 표 입니다.
Definition Description
(1) SK hynix Logo SK hynix
(2) Module Capacity Number of DDR4 DRAM storage in module
(3) Module Configuration Number of ranks of memory installed and Device organization
(4) Memory Technology DDR4 Product
(5) Module Speed Grade 1600K : 1600 11-11-11
1866M : 1866 13-13-13
2133P : 2133 15-15-15
2400T : 2400 17-17-17
2666U : 2666 18-18-18
(6) Module Type U : 288pin Unbuffered DIMM
R : 288pin Registered DIMM
S : 260 pin Unbuffered SO-DIMM
L : 288pin LRDIMM
N : 288pin NVDIMM
(7) Gerber Revision JEDEC Reference design file used for this design
(8) SPD Revision JEDEC SPD Revision Encoding and Additions level
(9) 2D Barcode  
(10) Eco Logo  
(11) CE Mark  
(12) Country Country of origin
(13) Part Number Please refer to the [SUPPORT > Technical Support > Part Number Decoder]
(14) Module Option Code Please refer to the next slide
(15) Process Code Internal use
(16) Year & Week Code of Manufactured Year & Week

Module Option Code Information

Module Option Code Information Module Option Code Information의 Meaning, Detail Description, Remark를 나타낸 표 입니다.
Meaning Detail Description Remark
N0 NT / NF w/o TS, w/o FDHS
  • Int. = Integrated
  • w/o = with out
  • TS = Thermal Sensor
  • RCD = Registering Clock Driver
  • DB = Data Buffer
  • FDHS = Full DIMM Heat Spreader
T0 TS / NF Integrated TS w/o FDHS
T1 TS / NH / Montage Int. TS w/o FDHS, Montage RCD B1 / DB A1
T2 TS / NH / Montage Int. TS w/o FDHS, Montage RCD C0 / DB B0
T3 TS / NH / Montage Int. TS w/o FDHS, Montage RCD A0 / TBD
T7 TS / NH / TI Int. TS w/o FDHS, TI RCD / DB
TD TS / NH / IDT Int. TS w/o FDHS, IDT RCD C0 / DB B1
TE TS / NH / IDT Int. TS w/o FDHS, IDT RCD C0 / DB A1
TF TS / NH / IDT Int. TS w/o FDHS, IDT RCD A1 / DB A3
TL TS / NH / INPHI Int. TS w/o FDHS, INPHI RCD GS02 / DBGS02
TM TS / NH / INPHI Int. TS w/o FDHS, INPHI RCD GS02 / DBGS03
TN TS / NH / INPHI Int. TS w/o FDHS, INPHI RCD GS02 / DBGS02

Label Info. DDR3

DDR3 32GB 4Rx4 PC3L - 10600R-9-12 AB1 HMT84GT7AMR4A-H9 D3 AB, R1216297P

Label Information

Label Information DDR3 Label Information DDR3의 Definition, Description을 나타낸 표 입니다.
Definition Description
(1) SK hynix Logo SK hynix
(2) Module Capacity Number of DDR3 DRAM storage in module
(3) Module Configuration Number of ranks of memory installed and Device organization
(4) Memory Technology DDR3 Product ( ex : PC3L operatble at 1.35V and 1.5V tolerant )
(5) Module Bandwidth & Module Type U : 240pin Unbuffered DIMM
R : 240pin Registered DIMM
V : 240pin VLP Registered DIMM
S : 204pin Unbuffered SO-DIMM
L : 240pin LRDIMM
A : 204pin ECC SO-DIMM
E : 240pin VLP ECC UDIMM
M : 244pin ULP Mini UDIMM
(6) CAS Latency CAS Latency in clocks at maximum operating frequency
(7) SPD Revision JEDEC SPD Revision Encoding and Additions level
(8) Gerber Revision JEDEC Reference design file used for this design
(9) 2D Barcode  
(10) Eco Logo  
(11) CE Mark  
(12) Country Country of origin
(13) Part Number Please refer to the [SUPPORT > Technical Support > Part Number Decoder]
(14) Module Option Code Please refer to the next slide
(15) Process Code Internal use
(16) Year & Week Code of Manufactured Year & Week

Module Option Code Information

Module Option Code Information Module Option Code Information의 Meaning, Detail Description, Remark를 나타낸 표 입니다.
Meaning Detail Description Remark
N0 NT/NF w/o TS, w/o FDHS
  • Int. = Integrated
  • w/o = with out
  • TS = Thermal Sensor
  • Reg. = Register
  • FDHS = Full DIMM Heat Spreader
T0 TS/NF Integrated TS w/o FDHS
T1 TS/NH/INPHI Int. TS w/o FDHS, INPHI Reg. / PLL B2 GS-04
T2 TS/NH/INPHI Int. TS w/o FDHS, INPHI Reg. / PLL LV GS-02
T3 TS/NH/INPHI Int. TS w/o FDHS, INPHI Reg. / PLL UV GS-02
T4 TS/NH/INPHI Int. TS w/o FDHS, INPHI Reg. / PLL XV GS-02
T6 TS/NH/IDT Int. TS w/o FDHS, IDT Reg. / PLL 5 (5.0)
T7 TS/NH/IDT Int. TS w/o FDHS, IDT Reg. / PLL B (HLB)
T8 TS/NH/IDT Int. TS w/o FDHS, IDT Reg. / PLL A1 (Evergreen)
TB TS/NH/TI Int. TS w/o FDHS, TI Reg. / PLL 3.1
TC TS/NH/TI Int. TS w/o FDHS, TI Reg. / PLL 4.2
TD TS/NH/TI Int. TS w/o FDHS, TI Reg. / PLL 5.0
D1 TS/FD/INPHI Int. TS & FDHS, INPHI Reg. / PLL B2 GS-04
D2 TS/FD/INPHI Int. TS & FDHS, INPHI Reg. / PLL LV GS-02
D3 TS/FD/INPHI Int. TS & FDHS, INPHI Reg. / PLL UV GS-02
D4 TS/FD/INPHI Int. TS & FDHS, INPHI Reg. / PLL XV GS-02
D6 TS/FD/IDT Int. TS & FDHS, IDT Reg. / PLL 5 (5.0)
D7 TS/FD/IDT Int. TS & FDHS, IDT Reg. / PLL B (HLB)
D8 TS/FD/IDT Int. TS & FDHS, IDT Reg. / PLL A1 (Evergreen)
DB TS/FD/TI Int. TS & FDHS, TI Reg. / PLL 3.1
DC TS/FD/TI Int. TS & FDHS, TI Reg. / PLL 4.2
DD TS/FD/TI Int. TS & FDHS, TI Reg. / PLL 5.0
M1 TS/FD/INPHI Rev 1st Int. TS & FDHS, INPHI MB iMB02-GS02A
M2 TS/FD/INPHI Rev 2nd Int. TS & FDHS, INPHI MB Revision 2
M6 TS/FD/IDT Rev 1st Int. TS & FDHS, IDT MB Greendale (TBD)
M7 TS/FD/IDT Rev 2nd Int. TS & FDHS, IDT Revision (TBD)
MB TS/FD/Montage Rev 1st Int. TS & FDHS, Montage MB C0
MC TS/FD/Montage Rev 2nd Int. TS & FDHS, Montage Revision 2