Specifications
Density별 Specifications
Density별 Product, NAND Information, Part Number, Package Size, Package Type 정보를 나타낸 표 입니다.
| Density |
Product |
NAND Information |
Part Number |
Package Size |
Package Type |
| 4GB |
eMMC4.5 |
1ynm 32Gb |
H26M31001HPR |
11.5x13x0.8 |
153ball FBGA |
| 8GB |
eMMC5.1 |
1ynm 64Gb |
H26M41208HPR |
11.5x13x0.8 |
153ball FBGA |
| 16GB |
eMMC5.1 |
1ynm 64Gb |
H26M52208FPR |
11.5x13x0.8 |
153ball FBGA |
| eMMC5.1 |
1znm 128Gb |
H26M51002KPR |
11.5x13x0.8 |
153ball FBGA |
| 32GB |
eMMC5.1 |
1ynm 64Gb |
H26M64208EMR |
11.5x13x1.0 |
153ball FBGA |
| eMMC5.1 |
1znm 128Gb |
H26M62002JPR |
11.5x13x0.8 |
153ball FBGA |
| 64GB |
eMMC5.1 |
1ynm 64Gb |
H26M78208CMR |
11.5x13x1.0 |
153ball FBGA |
| eMMC5.1 |
1znm 128Gb |
H26M74002HMR |
11.5x13x1.0 |
153ball FBGA |
| 128GB |
eMMC5.1 |
3D-V2 128Gb |
H26M88002AMR |
11.5x13x1.0 |
153ball FBGA |
| eMMC5.1 |
3D-V4 256Gb |
H26T87001CMR |
11.5x13x1.0 |
153ball FBGA |
Firmware Features
Firmware Features
JEDEC Version별 Features, SK hynix Version(v4.41, v4.5, v5.0, v5.1) 정보를 나타낸 표 입니다.
| JEDEC Version |
Features |
SK hynix Version |
| v4.41 |
v4.5 |
v5.0 |
v5.1 |
| eMMC4.5 |
HS200 |
X |
O |
O |
O |
| Discard |
X |
O |
O |
O |
| Power Off Notification |
X |
O |
O |
O |
| Packed Command |
X |
O |
O |
O |
| Cache |
X |
O |
O |
O |
| Data Tag |
X |
O |
O |
O |
| Sanitize |
X |
O |
O |
O |
| Context ID |
X |
O |
O |
O |
| Large Sector Size |
X |
O |
O |
O |
| Real Time Clock |
X |
O |
O |
O |
| Dynamic Device Capacity |
X |
O |
O |
O |
| Extended Partition Types |
X |
O |
O |
O |
| Auto-BKOP |
X |
O |
O |
O |
| eMMC5.0 |
HS400 |
X |
X |
O |
O |
| Field FW update |
X |
X |
O |
O |
| PON-Sleep Clarification |
X |
X |
O |
O |
| Health(Smart) Report |
O |
O |
O |
O |
| Production State Awareness |
X |
X |
O |
O |
| eMMC5.1 |
CMD Queuing (Optional) |
X |
X |
X |
O |
| Cache Barrier |
X |
X |
X |
O |
| Cache Flushing Report |
X |
X |
X |
O |
| RPMB throughput Improve |
X |
X |
O |
O |
| BKOP control |
X |
X |
X |
O |
| HCI for CMD queuing |
X |
X |
X |
O |
| Enhanced Strobe |
X |
X |
X |
O |
| Secure Write Protection (Optional) |
X |
X |
X |
O |
Automotive Product List
Automotive Product List
Automotive Product List 정보를 Part Number, Density, Organization, Temperature, Product Grade, Voltage, PKG, Product Status로 구분하여 나타낸 표 입니다.
| Part Number |
Density |
Organization |
Temperature |
Product Grade* |
Voltage |
PKG |
Product Status |
| H26M41103HPRA |
8GB |
SDP |
-40℃ ~ 85℃ |
AT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M41103HPRI |
8GB |
SDP |
-40℃ ~ 85℃ |
IT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M52103FMRA |
16GB |
DDP |
-40℃ ~ 85℃ |
AT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M52103FMRI |
16GB |
DDP |
-40℃ ~ 85℃ |
IT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M64103EMRA |
32GB |
QDP |
-40℃ ~ 85℃ |
AT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M64103EMRI |
32GB |
QDP |
-40℃ ~ 85℃ |
IT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M78103CCRA |
64GB |
ODP |
-40℃ ~ 85℃ |
AT |
3.3V/1.8V |
FBGA |
Mass Production |
| H26M78103CCRI |
64GB |
ODP |
-40℃ ~ 85℃ |
IT |
3.3V/1.8V |
FBGA |
Mass Production |
1) AT part is in compliance with AEC-Q100 and also developed based on the Automotive base-line.
2) IT part is in compliance with TS16949 and provides the same device longevity as AT parts.
