PRODUCTSeMMC
Overview
eMMC5.1 solution in SK hynix
최신의 3D technology 를 적용한 eMMC5.1 제품은 기존 제품 대비 보다 높은 성능과 신뢰성 특성을 가지고 있으며, mobile application 에서 보다 향상된 사용자 경험을 제공하게 될 것입니다.
Introducing SK hynix eMMC5.1
Full new features available
- Command queuing
- Cache flushing report
- Cache barrier
- Etc.
- Advanced core processor
- Increased SRAM size
- Higher coding execution speed
- New high speed NAND
- Sustaining initial performance
- Improved latency
- Optimized mapping structure
- Improved read reclaim algorithm
- Enhanced G.C and mapping update method
Performance comparison
3D NAND technology 와 자사의 최신 FW 기술이 적용된 eMMC5.1은 보다 향상된 성능을 제공하며, 다양한 application에 채용되어 보다 빠르고 안정적인 서비스를 제공 하고 있습니다.
Sequential Unit: MB/s
Random Unit: K IOPS
Specifications
| Density | Product | NAND Information | Part Number | Package Size | Package Type |
|---|---|---|---|---|---|
| 4GB | eMMC4.5 | 1ynm 32Gb | H26M31001HPR | 11.5x13x0.8 | 153ball FBGA |
| 8GB | eMMC5.1 | 1ynm 64Gb | H26M41204HPR | 11.5x13x0.8 | 153ball FBGA |
| eMMC5.1 | 1ynm 64Gb | H26M41208HPR | 11.5x13x0.8 | 153ball FBGA | |
| 16GB | eMMC5.1 | 1ynm 64Gb | H26M52208FPR | 11.5x13x0.8 | 153ball FBGA |
| eMMC5.1 | 1znm 128Gb | H26M51002KPR | 11.5x13x0.8 | 153ball FBGA | |
| 32GB | eMMC5.1 | 1ynm 64Gb | H26M64208EMR | 11.5x13x1.0 | 153ball FBGA |
| eMMC5.1 | 1znm 128Gb | H26M62002JPR | 11.5x13x0.8 | 153ball FBGA | |
| 64GB | eMMC5.1 | 1ynm 64Gb | H26M78208CMR | 11.5x13x1.0 | 153ball FBGA |
| eMMC5.1 | 1znm 128Gb | H26M74002HMR | 11.5x13x1.0 | 153ball FBGA | |
| 128GB | eMMC5.1 | 3D-V2 128Gb | H26M88002AMR | 11.5x13x1.0 | 153ball FBGA |
| eMMC5.1 | 3D-V4 256Gb | H26T87001CMR | 11.5x13x1.0 | 153ball FBGA |
Firmware Features
| JEDEC Version | Features | SK hynix Version | |||
|---|---|---|---|---|---|
| v4.41 | v4.5 | v5.0 | v5.1 | ||
| eMMC4.5 | HS200 | X | O | O | O |
| Discard | X | O | O | O | |
| Power Off Notification | X | O | O | O | |
| Packed Command | X | O | O | O | |
| Cache | X | O | O | O | |
| Data Tag | X | O | O | O | |
| Sanitize | X | O | O | O | |
| Context ID | X | O | O | O | |
| Large Sector Size | X | O | O | O | |
| Real Time Clock | X | O | O | O | |
| Dynamic Device Capacity | X | O | O | O | |
| Extended Partition Types | X | O | O | O | |
| Auto-BKOP | X | O | O | O | |
| eMMC5.0 | HS400 | X | X | O | O |
| Field FW update | X | X | O | O | |
| PON-Sleep Clarification | X | X | O | O | |
| Health(Smart) Report | O | O | O | O | |
| Production State Awareness | X | X | O | O | |
| eMMC5.1 | CMD Queuing (Optional) | X | X | X | O |
| Cache Barrier | X | X | X | O | |
| Cache Flushing Report | X | X | X | O | |
| RPMB throughput Improve | X | X | O | O | |
| BKOP control | X | X | X | O | |
| HCI for CMD queuing | X | X | X | O | |
| Enhanced Strobe | X | X | X | O | |
| Secure Write Protection (Optional) | X | X | X | O | |
Automotive Product List
| Part Number | Density | Organization | Temperature | Product Grade* | Voltage | PKG | Product Status |
|---|---|---|---|---|---|---|---|
| H26M41103HPRA | 8GB | SDP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
| H26M41103HPRI | 8GB | SDP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
| H26M52103FMRA | 16GB | DDP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
| H26M52103FMRI | 16GB | DDP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
| H26M64103EMRA | 32GB | QDP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
| H26M64103EMRI | 32GB | QDP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
| H26M78103CCRA | 64GB | ODP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
| H26M78103CCRI | 64GB | ODP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
1) AT part is in compliance with AEC-Q100 and also developed based on the Automotive base-line.
2) IT part is in compliance with TS16949 and provides the same device longevity as AT parts.
