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Overview

eMMC5.1 solution in SK hynix

최신의 3D technology 를 적용한 eMMC5.1 제품은 기존 제품 대비 보다 높은 성능과 신뢰성 특성을 가지고 있으며, mobile application 에서 보다 향상된 사용자 경험을 제공하게 될 것입니다.

Introducing SK hynix eMMC5.1

Introducing SK hynix eMMC5.1. 다음 내용 참조

Full new features available
  • Command queuing
  • Cache flushing report
  • Cache barrier
  • Etc.
Advanced controller
  • Advanced core processor
  • Increased SRAM size
  • Higher coding execution speed
Higher performance
  • New high speed NAND
  • Sustaining initial performance
  • Improved latency
Innovative in-house firmware
  • Optimized mapping structure
  • Improved read reclaim algorithm
  • Enhanced G.C and mapping update method

Performance comparison

3D NAND technology 와 자사의 최신 FW 기술이 적용된 eMMC5.1은 보다 향상된 성능을 제공하며, 다양한 application에 채용되어 보다 빠르고 안정적인 서비스를 제공 하고 있습니다.

Sequential Unit: MB/s

읽기 속도는 eMMC5.1이 270MB/s이며, 3D eMMC5.1은 280MB/s입니다. 쓰기 속도는 eMMC5.1이 140MB/s이며, 3D eMMC5.1은 210MB/s입니다.

Random Unit: K IOPS

읽기 속도는 eMMC5.1이 5K IOPS이며, 3D eMMC5.1은 7K IOPS입니다. 쓰기 속도는 eMMC5.1이 8K IOPS이며, 3D eMMC5.1은 10K IOPS입니다.

Specifications

Density별 Specifications Density별 Product, NAND Information, NAND Stack, Part Number, Package Size 정보를 나타낸 표 입니다.
Density Product NAND Information NAND Stack Part Number Package Size
8GB eMMC5.0 1xnm 64Gb 1 H26M41103HPR 11.5x13x0.8
eMMC5.1 1ynm 64Gb H26M41204HPR 11.5x13x0.8
16GB eMMC5.0 1xnm 64Gb 2 H26M52103FMR 11.5x13x1.0
eMMC5.1 1ynm 64Gb H26M52208FPR 11.5x13x0.8
32GB eMMC5.0 1xnm 64Gb 3 H26M64103EMR 11.5x13x1.0
eMMC5.1 1ynm 64Gb H26M64208EMR 11.5x13x1.0
64GB eMMC5.0 1xnm 64Gb 4 H26M78103CCR 11.5x13x1.2
eMMC5.1 1ynm 64Gb H26M78208CMR 11.5x13x1.0
16GB eMMC5.1 3D-V2 128Gb 1 H26M51002HPR 11.5x13x0.8
32GB eMMC5.1 3D-V2 128Gb 2 H26M62002GMR 11.5x13x1.0
64GB eMMC5.1 3D-V2 128Gb 4 H26M74002EPR 11.5x13x1.0
128GB eMMC5.1 3D-V2 128Gb 8 H26M88002AMR 11.5x13x1.0

Firmware Features

Firmware Features JEDEC Version별 Features, SK hynix Version(v4.41, v4.5, v5.0, v5.1) 정보를 나타낸 표 입니다.
JEDEC Version Features SK hynix Version
v4.41 v4.5 v5.0 v5.1
eMMC4.5 HS200 X O O O
Discard X O O O
Power Off Notification X O O O
Packed Command X O O O
Cache X O O O
Data Tag X O O O
Sanitize X O O O
Context ID X O O O
Large Sector Size X O O O
Real Time Clock X O O O
Dynamic Device Capacity X O O O
Extended Partition Types X O O O
Auto-BKOP X O O O
eMMC5.0 HS400 X X O O
Field FW update X X O O
PON-Sleep Clarification X X O O
Health(Smart) Report O O O O
Production State Awareness X X O O
eMMC5.1 CMD Queuing (Optional) X X X O
Cache Barrier X X X O
Cache Flushing Report X X X O
RPMB throughput Improve X X O O
BKOP control X X X O
HCI for CMD queuing X X X O
Enhanced Strobe X X X O
Secure Write Protection (Optional) X X X O

Automotive Product List

Automotive Product List Automotive Product List 정보를 Part Number, Density, Organization, Temperature, Product Grade, Voltage, PKG, Product Status로 구분하여 나타낸 표 입니다.
Part Number Density Organization Temperature Product Grade* Voltage PKG Product Status
H26M41103HPRA 8GB SDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M41103HPRI 8GB SDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M52103FMRA 16GB DDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M52103FMRI 16GB DDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M64103EMRA 32GB QDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M64103EMRI 32GB QDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M78103CCRA 64GB ODP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M78103CCRI 64GB ODP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production

1) AT part is in compliance with AEC-Q100 and also developed based on the Automotive base-line.
2) IT part is in compliance with TS16949 and provides the same device longevity as AT parts.