PRODUCTSeMMC
Overview
eMMC5.1 solution in SK hynix
최신의 3D technology 를 적용한 eMMC5.1 제품은 기존 제품 대비 보다 높은 성능과 신뢰성 특성을 가지고 있으며, mobile application 에서 보다 향상된 사용자 경험을 제공하게 될 것입니다.
Introducing SK hynix eMMC5.1
Full new features available
- Command queuing
- Cache flushing report
- Cache barrier
- Etc.
- Advanced core processor
- Increased SRAM size
- Higher coding execution speed
- New high speed NAND
- Sustaining initial performance
- Improved latency
- Optimized mapping structure
- Improved read reclaim algorithm
- Enhanced G.C and mapping update method
Performance comparison
3D NAND technology 와 자사의 최신 FW 기술이 적용된 eMMC5.1은 보다 향상된 성능을 제공하며, 다양한 application에 채용되어 보다 빠르고 안정적인 서비스를 제공 하고 있습니다.
Sequential Unit: MB/s
Random Unit: K IOPS
Specifications
Density | Product | NAND Information | Part Number | Package Size | Package Type |
---|---|---|---|---|---|
4GB | eMMC4.5 | 1ynm 32Gb | H26M31001HPR | 11.5x13x0.8 | 153ball FBGA |
8GB | eMMC5.1 | 1ynm 64Gb | H26M41204HPR | 11.5x13x0.8 | 153ball FBGA |
eMMC5.1 | 1ynm 64Gb | H26M41208HPR | 11.5x13x0.8 | 153ball FBGA | |
16GB | eMMC5.1 | 1ynm 64Gb | H26M52208FPR | 11.5x13x0.8 | 153ball FBGA |
eMMC5.1 | 1znm 128Gb | H26M51002KPR | 11.5x13x0.8 | 153ball FBGA | |
32GB | eMMC5.1 | 1ynm 64Gb | H26M64208EMR | 11.5x13x1.0 | 153ball FBGA |
eMMC5.1 | 1znm 128Gb | H26M62002JPR | 11.5x13x0.8 | 153ball FBGA | |
64GB | eMMC5.1 | 1ynm 64Gb | H26M78208CMR | 11.5x13x1.0 | 153ball FBGA |
eMMC5.1 | 1znm 128Gb | H26M74002HMR | 11.5x13x1.0 | 153ball FBGA | |
128GB | eMMC5.1 | 3D-V2 128Gb | H26M88002AMR | 11.5x13x1.0 | 153ball FBGA |
eMMC5.1 | 3D-V4 256Gb | H26T87001CMR | 11.5x13x1.0 | 153ball FBGA |
Firmware Features
JEDEC Version | Features | SK hynix Version | |||
---|---|---|---|---|---|
v4.41 | v4.5 | v5.0 | v5.1 | ||
eMMC4.5 | HS200 | X | O | O | O |
Discard | X | O | O | O | |
Power Off Notification | X | O | O | O | |
Packed Command | X | O | O | O | |
Cache | X | O | O | O | |
Data Tag | X | O | O | O | |
Sanitize | X | O | O | O | |
Context ID | X | O | O | O | |
Large Sector Size | X | O | O | O | |
Real Time Clock | X | O | O | O | |
Dynamic Device Capacity | X | O | O | O | |
Extended Partition Types | X | O | O | O | |
Auto-BKOP | X | O | O | O | |
eMMC5.0 | HS400 | X | X | O | O |
Field FW update | X | X | O | O | |
PON-Sleep Clarification | X | X | O | O | |
Health(Smart) Report | O | O | O | O | |
Production State Awareness | X | X | O | O | |
eMMC5.1 | CMD Queuing (Optional) | X | X | X | O |
Cache Barrier | X | X | X | O | |
Cache Flushing Report | X | X | X | O | |
RPMB throughput Improve | X | X | O | O | |
BKOP control | X | X | X | O | |
HCI for CMD queuing | X | X | X | O | |
Enhanced Strobe | X | X | X | O | |
Secure Write Protection (Optional) | X | X | X | O |
Automotive Product List
Part Number | Density | Organization | Temperature | Product Grade* | Voltage | PKG | Product Status |
---|---|---|---|---|---|---|---|
H26M41103HPRA | 8GB | SDP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
H26M41103HPRI | 8GB | SDP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
H26M52103FMRA | 16GB | DDP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
H26M52103FMRI | 16GB | DDP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
H26M64103EMRA | 32GB | QDP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
H26M64103EMRI | 32GB | QDP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
H26M78103CCRA | 64GB | ODP | -40℃ ~ 85℃ | AT | 3.3V/1.8V | FBGA | Mass Production |
H26M78103CCRI | 64GB | ODP | -40℃ ~ 85℃ | IT | 3.3V/1.8V | FBGA | Mass Production |
1) AT part is in compliance with AEC-Q100 and also developed based on the Automotive base-line.
2) IT part is in compliance with TS16949 and provides the same device longevity as AT parts.