레이어팝업 내용 시작 128GB 3DS LRDIMM 닫기

128GB 3DS LRDIMM is a high-density module product built with SK hynix’s TSV technology. TSV (Through Silicon Via) is a technology of making via holes on a wafer and 3D-stacking through chip-to-chip/wafer-to-wafer bonding.
The term 3DS refers to the single package 3D solution comprised of four stacked DRAM dies and a logic controller.
TSV technology will enable memory manufacturers to build higher-speed, higher-density, and smaller-sized module products.

128GB 3DS LRDIMM
128GB 3DS LRDIMM 128GB 3DS LRDIMM의 Mode, Tech, Based Density, Layer, Module Density, Data Width, Speed, Voltage를 나타낸 표입니다.
Mode Tech Based Density Layer Module Density Data Width Speed Voltage
DDR4 2ynm 8Gb TSV 4Hi 128GB x72 2400 1.2V