eMMC5.1 solution in SK hynix

The 3D technology based eMMC5.1 product provides better performance and reliability, and will improve user experience of mobile applications.

Introducing SK hynix eMMC5.1

Performance comparison

3D NAND eMMC5.1 with SK hynix's lastest firmware technology provides improved performance and will give various applications faster and reliable experience.

Sequential Unit: MB/s

Random Unit: K IOPS


Density Product NAND Information NAND Stack Part Number Package Size
8GB eMMC5.0 1xnm 64Gb 1 H26M41103HPR 11.5x13x0.8
eMMC5.1 1ynm 64Gb H26M41204HPR 11.5x13x0.8
16GB eMMC5.0 1xnm 64Gb 2 H26M52103FMR 11.5x13x1.0
eMMC5.1 1ynm 64Gb H26M52208FPR 11.5x13x0.8
32GB eMMC5.0 1xnm 64Gb 3 H26M64103EMR 11.5x13x1.0
eMMC5.1 1ynm 64Gb H26M64208EMR 11.5x13x1.0
64GB eMMC5.0 1xnm 64Gb 4 H26M78103CCR 11.5x13x1.2
eMMC5.1 1ynm 64Gb H26M78208CMR 11.5x13x1.0
16GB eMMC5.1 3D-V2 128Gb 1 H26M51002HPR 11.5x13x0.8
32GB eMMC5.1 3D-V2 128Gb 2 H26M62002GMR 11.5x13x1.0
64GB eMMC5.1 3D-V2 128Gb 4 H26M74002EPR 11.5x13x1.0
128GB eMMC5.1 3D-V2 128Gb 8 H26M88002AMR 11.5x13x1.0

Firmware Features

JEDEC Version Features SK hynix Version
v4.41 v4.5 v5.0 v5.1
eMMC4.5 HS200 X O O O
Discard X O O O
Power Off Notification X O O O
Packed Command X O O O
Cache X O O O
Data Tag X O O O
Sanitize X O O O
Context ID X O O O
Large Sector Size X O O O
Real Time Clock X O O O
Dynamic Device Capacity X O O O
Extended Partition Types X O O O
eMMC5.0 HS400 X X O O
Field FW update X X O O
PON-Sleep Clarification X X O O
Health(Smart) Report O O O O
Production State Awareness X X O O
eMMC5.1 CMD Queuing (Optional) X X X O
Cache Barrier X X X O
Cache Flushing Report X X X O
RPMB throughput Improve X X O O
BKOP control X X X O
HCI for CMD queuing X X X O
Enhanced Strobe X X X O
Secure Write Protection (Optional) X X X O

Automotive Product List

Part Number Density Organization Temperature Product Grade* Voltage PKG Product Status
H26M41103HPRA 8GB SDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M41103HPRI 8GB SDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M52103FMRA 16GB DDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M52103FMRI 16GB DDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M64103EMRA 32GB QDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M64103EMRI 32GB QDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M78103CCRA 64GB ODP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M78103CCRI 64GB ODP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production

1) AT part is in compliance with AEC-Q100 and also developed based on the Automotive base-line.
2) IT part is in compliance with TS16949 and provides the same device longevity as AT parts.