Layer Contents Start 128GB 3DS LRDIMM CLOSE

128GB 3DS LRDIMM is a high-density module product built with SK hynix’s TSV technology. TSV (Through Silicon Via) is a technology of making via holes on a wafer and 3D-stacking through chip-to-chip/wafer-to-wafer bonding.
The term 3DS refers to the single package 3D solution comprised of four stacked DRAM dies and a logic controller.
TSV technology will enable memory manufacturers to build higher-speed, higher-density, and smaller-sized module products.

128GB 3DS LRDIMM
128GB 3DS LRDIMM
Mode Tech Based Density Layer Module Density Data Width Speed Voltage
DDR4 2ynm 8Gb TSV 4Hi 128GB x72 2400 1.2V