CSR

CORPORATE SOCIAL RESPONSIBILITYRegulation Compliance

RoHS & REACH

RoHS

符合RoHS(在电气和电子设备使用某些有害物质的限制)
此法目的是用法律在电气和电子设备使用的有害物质制定限制,保护人类健康和WEEE的可持续复苏。 2006年7月起 新的电气和电子必须不含有铅,汞,镉,6铬,多溴联苯核苷酸咀(PBB)或 多溴联苯醚 核苷酸咀(PBDE)。
6 Critical Hazardous Substance
Pb, Cd, Cr+6, Hg, PBB (Polybrominated biphenyl), PBDE (Polybrominated diphenylethers)
Thresholds for RoHS Substances
Substance MCV (Maximum Concentration Value)
Cd < 100 ppm
Pb < 1000 ppm
Hg < 1000 ppm
Cr+6 < 1000 ppm
PBB < 1000 ppm
PBDE < 1000 ppm

RoHS 2 应对及准备

2011年发表的RoHS2,使用了保证未使用禁用物质的CE Mark(2013年),废除了例外条款(2016年),添加了禁用物质(2015年)等内容。SK hynix对Module产品履行了CE Mark,认知了添加的禁用物质,并根据2019年的生效日期,准备着本公司的保证体系。
添加的禁用物质如下。

Substance CAS No Limit
DEHP (Bis(2-ethylhexyl) phthalate) 117-81-7 1000 ppm
BBP (Butylbenzyl phthalate) 85-68-7 1000 ppm
DBP (Dibuthyl phthalate) 84-74-2 1000 ppm
DIBP (Di isobutyl phthalate) 84-69-5 1000 ppm

What is REACH

REACH是注册,评估,化学品的授权的术语是根据每年一吨以上生产和输入的物品,进行数量和危险度的注册,评估,许可,限制, 而进行新化学物质的管理规定。不仅仅是禁止使用六大有害物质,而且掌握并管理全部化学物质。

what is reach

SK hynix Compliance Situation to REACH

SK hynix根据以下事实,保证符合EU REACH法规。SK hynix产品虽然属于Article,但不排放上述有害物质,固不需履行登记义务。 而且所登记的产品不包含SVHC高危险候补物质及高危险物质,因此也没有申报对象及义务。
以此作为保证,对顾客要求的信息,根据未公开保证书等适当程序,与顾客共享产品构成信息。 SK hynix为了保证以后可能添加的新SVHC物质,与原材料供应商保持通信系统及分享信息等合作关系。
2015年,登记的SVHC高危险候补物质有163种,高危险物质有31种。

China RoHS

概要

  • 电子信息产品污染防治法 : 中国政府要求的所有的电子信息产品,环境污染法规,行政准则管理指南。
  • 有效日期 : 03/01/2007
  • 要求 : 危险物质,有害物质的信息公开,标志包装回收标志
  • 受控物质 : 六种物质。 Pb(铅),汞(水银),镉(镉),六价铬(6铬),多溴联苯,多溴二苯醚
Substance MCV (Maximum Concentration Value)
Cd < 100 ppm
Pb < 1000 ppm
Hg < 1000 ppm
Cr+6 < 1000 ppm
PBB < 1000 ppm
PBDE < 1000 ppm

要求有害物质标志

  •   如果符合满足有害物质容许浓度 : “e” 的标志
  •   如果超过的有害物质容许浓度 : 标记环境保护使用期限

要求 -有害物质的信息公开

  • 有害物质或产品含有浓度如果超过SJ/T11363-2006规定:'X'号显示
  • 产品未含有有害物质或低于SJ/T11363-2006 规定 :'O' 号显示

要求—包装回收标志

CB
  • This mark is attached to inner and outer packing Box.
  • “CB” mean that the used packing material of products is Corrugated Cardboard.
  • Standard : GB18455-2001 of China (Packaging Recycling Marks standard)

Component Product

  • 有害物质符号 :
  • 公开有害物质情报
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
Si CHIP
GOLD WIRE
MOLD COMPOUND
LEAD FRAME
SUBSTRATE
SOLDER BALL
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type

Module Product

  • 有害物质符号 :
  • 公开有害物质情报
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
Component
PCB
ACTIVEIC
CAPACITOR
RESISTOR
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • Resister in module contains lead partially in order to electronic quality. It is impossible to unuse by present technological level

CIS Product

  • 有害物质符号 :
  • 公开有害物质情报
Component Name Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chrome
(Cr6+)
Polybrominated
Biphenyl
(PBB)
Polybrominated
Biphenyl Ether
(PBDE)
Si CHIP
GLASS
SOLDER BALL
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type

SSD Product

  • 有害物质符号 :
  • 公开有害物质情报
Part Name Toxic or hazardous Substances and Elements
Pb Hg Cd Cr6+ PBB PBDE
PCB
Solder Paste
Active device
Passive device
Case
Accessory
  • : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
  • : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
  • Passive device Resistor in SSD contains Pb (lead) partially for electronic quality. It is impossible for disuse at present due to technological matter.

Halogen Free

Halogen 有害性以及代替必要性

卤族是指什么?
卤族包括氟(F)、氯(Cl)、溴(Br)、碘(I)等,活性较强,以Package材料的阻燃剂用于半导体行业。
有害性以及代替必要性
在燃烧过程中产生二氧化笨等有毒物质,并在人的体内长期积累,引发环境荷尔蒙问题。
特别是F、Cl、Br被认为向大气漏出会严重破坏臭氧层,EU等国际机构逐年加大限制力度。
从2008年起预计以EU、Japan为中心直接限制卤族,需要开发取代卤族用于半导体制造的物质

Halogen Free 限制规格

  • JPCA(Japan Electronics Packaging and Circuits Association) JPCA-ES-01-1999 defines Circuits and method for "halogen-free“

    Br < 0.09wt%(900ppm), CI < 0.09wt%(900ppm)

  • IEC(International Electrotechnical Commission) Finalized requirements of IEC 61249-2-21

    • 900ppm maximum CI, 900ppm maximum Br
    • 1500 ppm maximum total halogens
  • IPC - 4101B has adopted the IEC definition of halogen-free

    • 900ppm maximum CI, 900ppm maximum Br
    • 1500 ppm maximum total halogens
  • Note

    fluorine, iodine, and astatine (other Group VIIA halogens) are not restricted in the industry definition of "halogen-free“.

Mass Production Status

PRODUCT 07 08 09 10
DRM Compliance
NAND Flash Compliance
CIS Compliance

Halogen Free 产品区分

FROM TO
HXXXXXXXXXP-XXX HXXXXXXXXXR-XXX
P:RoHS Compliance R:RoHS Compliance + Halogen Free

应对保证书

PRODUCT Package RoHS REACH PFOS HALOGEN FREE
DRAM Component Satisfy Certificate [152KB] Satisfy Certificate [548KB] Satisfy Certificate [96KB] Partly Satisfy Certificate [96KB]
Module
NAND Flash Component
MCP Component
CIS Component
SiP Component
SSD Component

※ 因不含卤素产品,信息的规定可能会有所不同, 固贵公司可提供保证证书。